High-End electronic fabrics tab tom ntsib qhov teeb meem tsis txaus?
Tsis xav txog, thaum ntxov 2026, kev lag luam thev naus laus zis thoob ntiaj teb tau ntsib teeb meem ntawm cov khoom siv hluav taws xob uas tshwm sim los ntawm ib qho khoom siv: siab -kawg hluav taws xob- qibfiberglass ntaub. Tsav los ntawm kev loj hlob tawg ntawm AI servers, siab -kawg chips, thiab cov khoom ntim cov thev naus laus zis, qhov no zoo li cov khoom siv tseem ceeb tseem ceeb tau ntsib cov khoom tsis tau muaj dhau los - thov tsis txaus thiab tsis txaus. Nittobo, ib lub tuam txhab Nyij Pooj, tuav lub lag luam tseem ceeb hauv kev lag luam siab -kawg semiconductor ntim substrate hluav taws xob daim ntaub vim nws cov thev naus laus zis hauv qis -CTE cov ntaub ntawv hluav taws xob, dhau los ua qhov tseem ceeb ntawm cov AI chips thiab cov neeg siv khoom siv hluav taws xob los ntawm cov tuam txhab xws li Nvidia thiab Apple.
Qhov tsis txaus ntawm Electronic Cloth: AI Boom Ignites Material Bottlenecks
Cov ntaub ntawv hluav taws xob yog ib qho ntawm cov ntaub ntawv tseem ceeb rau kev tsim cov ntawv luam tawm Circuit boards (PCBs) thiab nti ntim substrates. Hauv kev ntim khoom siab heev (xws li Ntxuam-Tawm thiab 2.5D / 3D ntim), cov thermal expansion coefficients ntawm cov nti thiab cov substrate yuav tsum sib phim heev; txwv tsis pub, warping, cracking, los yog txawm tias tsis ua hauj lwm vim qhov kub thiab txias hloov yog heev. Nittobo's ultra-tsawg CTE fiberglass daim ntaub, nrog nws ze li zoo tib yam thermal expansion cov yam ntxwv rau silicon chips, tau dhau los ua ib qho tseem ceeb raw khoom rau siab -kawg nti substrates.
Nrog rau kev xa tawm sai ntawm thoob ntiaj teb AI suav cov txheej txheem, kev thov rau H100 / B100 qib AI chips los ntawm cov loj xws li Nvidia, AMD, Google, thiab Meta tau nce siab, tsav kev nce siab hauv kev txiav txim siab rau siab - kawg ABF (Ajinomoto Build-up Film) thiab BT substrates. BT substrates- siv dav hauv SoCs mobile, RF modules, thiab qee qhov AI accelerator chips- yog nyob ntawm Nittobo cov ntaub fiberglass. Raws li cov ntaub ntawv tsis ntev los no, Apple tau xa cov engineers mus rau Mitsubishi Gas Chemical (MGC) kom nkag siab txog nws cov txheej txheem tsim khoom BT substrate, tsuas yog los xyuas kom meej cov khoom ruaj ntseg rau cov khoom tshiab hauv 2026, suav nrog thawj lub foldable iPhone. Qualcomm kuj tau ceev nrooj hu rau cov chaw tsim khoom Nyij Pooj Me Obayashi Chemical sim thiab qhib lub chaw muag khoom thib ob, tab sis vim muaj kev txwv ntawm nws cov peev txheej tsim khoom thiab cov khoom lag luam tawm, qhov kev sib tw loj heev tsis zoo li nyob rau lub sijhawm luv.
Txawm hais tias Nittobo tau tshaj tawm lub peev xwm nthuav dav, lub peev xwm tshiab tsis xav tias yuav raug tso tawm kom txog rau thaum 2027. Qhov no txhais tau hais tias 2026 yuav yog lub xyoo uas muaj kev tsis txaus siab tshaj plaws ntawm high -kawg hluav taws xob fabrics, uas muaj feem cuam tshuam ncaj qha rau thoob ntiaj teb AI nti xa khoom, siab -kawg smartphone iterations, thiab txawm tias cov pace ntawm cov ntaub ntawv chaw tsim kho.
Tuam Tshoj boasts lub peev xwm loj fiberglass ntau lawm, tab sis qhov sib txawv tseem nyob hauv siab - khoom kawg.
Tuam Tshoj yog lub ntiaj teb loj tshaj plaws fiberglass tsim, nrog rau cov tuam txhab xws li Tuam Tshoj Jushi, Sinoma Science & Technology, Chongqing International Composite Materials (CPIC), thiab Honghe Technology, ranking thawj lub ntiaj teb no nyob rau hauv hluav taws xob daim ntaub ntau lawm. Txawm li cas los xij, nyob rau hauv high-kawg hluav taws xob cov ntaub ntawv, tshwj xeeb tshaj yog nyob rau hauv ultra- qis CTE, ultra-nyias (tsawg dua los yog sib npaug li 30μm), thiab siab flatness hluav taws xob cov ntaub siv rau kev ntim khoom siab heev, qhov sib txawv tseem muaj nyob rau hauv cov teb chaws txawv teb chaws.
Tam sim no, cov ntaub ntawv siv hluav taws xob hauv tsev feem ntau yog siv nyob rau nruab nrab - mus rau - qis- cov ntawv thov kawg xws li cov khoom siv hluav taws xob cov khoom siv hluav taws xob thiab cov khoom siv sib txuas lus PCBs, nrog rau CTE tus nqi feem ntau ntawm 4–6 ppm /℃. Nittobo's siab- cov khoom kawg, txawm li cas los xij, tuaj yeem tswj CTE qhov tseem ceeb hauv qab 2.5 ppm /℃thiab muaj cov khoom siv hluav taws xob zoo dua thiab qhov ruaj khov. Thaum Honghe Technology tau ua tiav ib feem hauv cheeb tsam ntawm siab -cov ntaub ntawv hluav taws xob kawg thiab nkag mus rau cov khoom siv ntawm Taiwanese tooj liab loj-clad laminate (CCL) cov tuam txhab, nws tseem tsis tau ua tiav qhov loj - nplai hloov pauv peev xwm hauv thaj chaw ntawm fiberglass ntaub rau BT substrates. CCL cov tuam txhab xws li Nanya New Materials thiab Shengyi Technology tseem ua haujlwm tau zoo hauv cov ntaub ntawv hluav taws xob hauv tsev, tab sis daim ntawv pov thawj lub voj voog ntev thiab cov txiaj ntsig tau hloov pauv zoo heev, ua rau nws nyuaj rau co Nittobo txoj haujlwm tseem ceeb hauv lub sijhawm luv.
Rau Suav teb, 2026 yog ob lub xyoo ntawm kev sib tw thiab lub qhov rais ntawm lub sijhawm. Lub sijhawm lub tshuab nqus tsev ntawm Nittobo muab lub qhov rais muaj txiaj ntsig rau kev qhia txog cov khoom siv hluav taws xob hauv tsev siab tshaj - kawg. Muaj cov cim qhia tias kev hloov pauv hauv tsev tau nrawm dua. Xyoo dhau los, cov tuam txhab fiberglass xws li Sinoma Science & Technology, International Composites, thiab Honghe Technology tau tshaj tawm kev nqis peev ntau ntxiv hauv cov khoom siv hluav taws xob siab - kawg thiab nthuav lawv cov peev txheej ntau lawm, ua kom muaj kev sib tw ntawm cov khoom siv hauv tsev!
Nyob rau hauv nthwv dej ntawm AI reshaping lub ntiaj teb no thev naus laus zis toj roob hauv pes, kev sib tw tiag tiag tau ntev txij li tau txav mus dhau algorithms thiab chips, txuas mus rau cov khoom siv tseem ceeb tshaj plaws. Ib qho zoo li cov ntaub fiberglass tam sim no tau dhau los ua "Achilles 'heel" txwv txoj kev loj hlob ntawm trillion -$ AI kev lag luam. Rau Suav teb, qhov no yog ob qho tib si kev sib tw hnyav thiab lub sijhawm keeb kwm los txhawb kev ywj pheej ntawm cov ntaub ntawv yooj yim. Tsuas yog los ntawm kev hla lub mais kawg "los ntawm cov nroj tsuag fiberglass mus rau wafer fab" tuaj yeem ua Tuam Tshoj tiag tiag tuav lub tswv yim hauv kev sib ntaus sib tua ntsiag to rau AI suav lub zog.
